Sustainable and Functional 3D Technology for Packaging of Adaptive Chip-Connected implants

New technology for soft chip integration

Current implant systems rely on cables, metal interconnects, and plastic packaging that are difficult to miniaturize and poorly match soft biological tissue. This project develops a new approach where conductive polymers and soft materials are directly printed onto chips. This enables flexible and stretchable interconnects that better match the human body, while reducing assembly steps and enabling scalable manufacturing.

Sustainable and scalable implant technology

The new technology reduces the use of metals and plastics and enables reusable electronic components, lowering cost and environmental impact. The developed methods are not only relevant for medical implants but also for applications such as sensors, semiconductors, and photonics. SOFT-PACK therefore strengthens the Dutch position in both medical technology and the semiconductor industry.