Quantum Sensing to characterize Integrated Graphene Photonic devices

Scaling graphene for real-life applications

Black Semiconductor is bringing graphene photonics from research to real‑world manufacturing on 300 mm CMOS wafers. This step is essential to unlock high‑performance, wafer‑scale devices, but it requires deep understanding of how graphene behaves inside complex production stacks. This project delivers that insight, turning hidden device behavior into actionable knowledge for industrial scale‑up.

Quantum Sensing makes the invisible visible

Graphene devices are contacted through thousands of microscopic metal vias buried under thick dielectric layers. While devices may work overall, today it is impossible to know whether each individual via contributes as intended. This project changes that by directly visualizing current flow at the via level, revealing inactive contacts, uneven current injection, and hidden inefficiencies that impact yield and reliability.

Enabling high volume manufacturing of integrated graphene photonics

By introducing advanced, fab‑compatible current imaging and modeling, this project supports faster learning cycles and smarter process decisions. The result is a practical characterization approach that fits pilot‑line and manufacturing environments, helping Black Semiconductor improve uniformity, increase yield, and confidently move graphene photonics toward high‑volume, commercial production.